CEI Internatonal Investments Viet Nam Co., Ltd.

Located in Binh Duong Province - VietNam

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CEI Contract Manufacturing Limited was listed on the main board of the Singapore Exchange Securities Trading Limited in March 2000.

 

The Company provides printed circuit board and box-build assembly, equipment design, cable harness assembly and manufacturing services. It is well equipped to provide value-added services such as materials management, circuit layout, prototype & development engineering, metal stamping, cable harnessing and precision machined components.

 

The Company serves customers in the industrial equipment market segment. These include electroluminescence displays used in industrial, transportation and medical applications; medical and health care equipment; office equipment as in digital photocopiers; analytical instruments as in gas and liquid chromatographs and measurement instruments; industrial safety controllers and environmental sensors, semiconductor equipment and SMT equipment.

 

The Company is ISO9001, ISO13485, ISO14001, UL508A, UL817 certified and AS9100 & TS16949 (Letter of Compliance). Headquartered in Singapore with manufacturing sites in Singapore, Batam (Indonesia), Ho Chi Minh City (Vietnam) and Shanghai (China).

Company Name CEI Internatonal Investments Viet Nam Co., Ltd.
Category Computer
Address 2 VSIP, Street 6
District Thuan An
Province/City Binh Duong Province
Country VietNam
Industrial Park Vietnam - Singapore Industrial Park (VSIP 1)
Phone Number 0274 378 2615
Fax 0274 378 2729
Email hr@cei.com.sg
Website www.cei.com.sg
Tax Number 3700403828
Registration Number 3700403828
Legal Representative Tien Sing Gee
Issued on 01/01/1970
Registration Date 28/11/2001
Legal Structure Limited Liability Company

Link with

 
Province/City

Binh Duong Province

 
Industrial Park

Vietnam - Singapore Industrial Park (VSIP 1)

Location Map & Landmarks

On-sale Properties

Price:

45.5 billion VND

Area:

5.000 m²

Location:

Thuận An, Bình Dương

Purpose:

For Lease

Price:

28 Mi VND

Area:

700 m²

Location:

Tân Uyên, Bình Dương

Purpose:

For Sale

Price:

Contact us

Area:

10.848 m²

Location:

Thuận An, Bình Dương

Purpose:

For Lease

Price:

24 billion VND

Area:

4.000 m²

Location:

Thuận An, Bình Dương

Purpose:

For Lease

Price:

288 million VND

Area:

5.500

Location:

Tân Uyên, Bình Dương

Purpose:

For Sale

Price:

180 Million VND

Area:

4.000 m²

Location:

Thuận An, Bình Dương

Purpose:

For Sale

Price:

40 Mi VND

Area:

666 m²

Location:

Thuận An, Bình Dương

Purpose:

For Sale

Price:

113.8 Mi VND

Area:

2.000 m²

Location:

Thuận An, Bình Dương

Purpose:

For Sale

Price:

100 Mi VND

Area:

2.000 m²

Location:

Thuận An, Bình Dương

Purpose:

For Sale

Price:

70 - 280 Mi VND

Area:

2.000 m² - 8.000 m²

Location:

Thuận An, Bình Dương

Purpose:

For Sale

Price:

39 Mi VND

Area:

700 m²

Location:

Thuận An, Bình Dương

Purpose:

For Sale

Price:

6 - 180 Mi VND

Area:

100 m² - 3.000 m²

Location:

Tân Uyên, Bình Dương

Purpose:

For Sale

NAICS/SIC/VN Code

334419

Other Electronic Component Manufacturing

3671

Electron Tubes

3679

Electronic Components, not elsewhere classified

26100

Manufacture of electronic components

Products of the company

Wafer Uv Eraser System I

APPLICATIONS

  • Complete erasing of charges of EPROM and Flash memory.
  • UV Curing and Hardening.
  • Removal of stress induce due to manufacturing processes.

FEATURES:

  • Flexible to handle 150mm and 200mm wafers without conversion
  • Class 1000 cleanliness
  • Multi wafers UV chamber for high throughput
  • Low cost of ownership
  • Wafer robot handling
  • Cassette to Cassette Transfer
  • Wafer aligner & OCR (Option)

Detail
Macro And Micro Optical Wafer Inspection System

APPLICATIONS

  • Wafer Sorting
  • Optical inspection with Inkless Binning.

FEATURES:

  • Atmospheric robot wafer handling
  • Capability to handle thin wafer (>6 mils)
  • Multi function- Cassette to Cassette Sort , Cassette to XY-stage for micro inspection
  • Inkless Binning catered to handle all Semi Std Map Format
  • Macro inspection (Frontside , Backside & Edge defect)
  • Tilting & Spin Module
  • Capable to integrate with any OEM Microscope
  • Optical Character Reader (OCR)
  • Smallest foot print
  • SEC II GEM (Option)
  • Wafer Aligner (Option)

Detail
Printed Circuit Board Assembly Capabilities

  • IPC J-STD, IPC-A-610E Class II & III

  • Materials IQC (ANSI/ASQC Z1.4)

  • SnPb and RoHS Soldering

  • Extra Large Board (630x570mm)

  • Fine Pitch Components (16 mils)

  • Micro BGA, CSP (0.5mm), 0201 chips

  • X-Ray, AOI and Digital Microscope

  • TCP ACF Bonding

  • In-Circuit Test Fixture & Software Development

  • Flying Probe Test Software

  • Labview PXI Component Test

  • Functional Tester Development

  • 2D/3D Barcode Development

  • Environment and ESS Testing

  • DFM, DFT and CAD Support

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Detail

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